Electroplated Diamond Wire Saw
Advanced plating diamond wire production proces
Wire preparation → Oil removal → acid treatment → washing → sand embedding → sand consolidation → wire collection
All-around Quality Control of Diamond Wire Saw
-Diameter online measuring
-High power microscope measuring
-SEM measuring
-Metallographic microscope measuring
-Diameter measuring
Diamond Wire image & Solar Mould
SiC Powder
Green SiC Powder
Black SiC Powder
Si-SiC
Si-SiC Kiln Furniture
Si-SiC Burner Nozzle
S-SiC
S-SiC Mechanical Componen
S-SiC Bullet Proof Ceramics
Si3N4-SiC
Si3N4-SiC Bricks for Waste Incineration
Si3N4-SiC Pump
Electroplated Diamond Wire Saw
For Cutting Solar Wafers
For Root Solar Silicon Body
For Cutting Crystal Sapphire
for Cutting Magnetic Materia
Diamond Wire for Cutting solar wafers
-
PRODUCTS DESCRIPTION APPLICATION DW-80 Bus/germ line Φ65 um Cutting Solar wafers Diamond particles 8-10 um Tensile force 4000 Breaking force ≥17N The diameter of Φ80 um DW-85 Bus/germ line Φ70 um Cutting Solar wafers Diamond particles 8-10 um Tensile force 4000 Breaking force ≥19N The diameter of Φ85 um DW-95 Bus/germ line Φ80 um Cutting Solar wafers Diamond particles 8-10 um Tensile force 4000 Breaking force ≥21N The diameter of Φ95 um DW-110 Bus/germ line Φ85 um Cutting Solar wafers Diamond particles 8-13 um Tensile force 4000 Breaking force ≥25N The diameter of Φ110 um
-
Cutting Silion Wafe and Solar Silica Wafer ↓
SiC Powder
Green SiC Powder
Black SiC Powder
Si-SiC
Si-SiC Kiln Furniture
Si-SiC Burner Nozzle
S-SiC
S-SiC Mechanical Componen
S-SiC Bullet Proof Ceramics
Si3N4-SiC
Si3N4-SiC Bricks for Waste Incineration
Si3N4-SiC Pump
Electroplated Diamond Wire Saw
For Cutting Solar Wafers
For Root Solar Silicon Body
For Cutting Crystal Sapphire
for Cutting Magnetic Materia
Diamond Wire for Root/truncation solar silicon body
Cutting the Silicon Ingot & DW cutting equipment ↓
-
PRODUCTS DESCRIPTION APPLICATION DW-350 Bus/germ line Φ280 um Root/truncation solar
silicon bodyDiamond particles 40-50 um Tensile force 3300 Breaking force ≥200N The diameter of Φ350 um DW-370 Bus/germ line Φ280 um Root/truncation solar
silicon bodyDiamond particles 40-50um Tensile force 3300 Breaking force ≥200N The diameter of Φ370 um DW-390 Bus/germ line Φ300 um Root/truncation solar
silicon bodyDiamond particles 40-50 um Tensile force 3300 Breaking force ≥230N The diameter of Φ390 um DW-450 Bus/germ line Φ350 um Root/truncation solar
silicon bodyDiamond particles 40-50um Tensile force 3300 Breaking force ≥280N The diameter of Φ450 um
SiC Powder
Green SiC Powder
Black SiC Powder
Si-SiC
Si-SiC Kiln Furniture
Si-SiC Burner Nozzle
S-SiC
S-SiC Mechanical Componen
S-SiC Bullet Proof Ceramics
Si3N4-SiC
Si3N4-SiC Bricks for Waste Incineration
Si3N4-SiC Pump
Electroplated Diamond Wire Saw
For Cutting Solar Wafers
For Root Solar Silicon Body
For Cutting Crystal Sapphire
for Cutting Magnetic Materia
Diamond Wire for Cutting and root the LED crystal sapphire
-
PRODUCTS DESCRIPTION APPLICATION DW-250 Bus/germ line Φ175 um Cutting the LED crystal sapphire Diamond particles 30-40um Tensile force 3300 Breaking force ≥80N The diameter of Φ250 um DW-420 Bus/germ line Φ350 um Cutting the LED crystal sapphire,
Root the LED crystalDiamond particles 30-40um Tensile force 3300 Breaking force ≥280N The diameter of Φ420 um 
← Cutting Crastal Sapphire
SiC Powder
Green SiC Powder
Black SiC Powder
Si-SiC
Si-SiC Kiln Furniture
Si-SiC Burner Nozzle
S-SiC
S-SiC Mechanical Componen
S-SiC Bullet Proof Ceramics
Si3N4-SiC
Si3N4-SiC Bricks for Waste Incineration
Si3N4-SiC Pump
Electroplated Diamond Wire Saw
For Cutting Solar Wafers
For Root Solar Silicon Body
For Cutting Crystal Sapphire
for Cutting Magnetic Materia
Diamond Wire for Cutting Magnetic material
PRODUCTS DESCRIPTION APPLICATION DW-180 Bus/germ line Φ140 um Cutting Magnetic material Diamond particles 20-30 um Tensile force 3300 Breaking force） ≥50N The diameter of Φ180 um
